Investigation of potential antibacterial action for postharvest copper treatments of cut Acacia holosericea

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dc.contributor.author Kamani Ratnayake
dc.contributor.author Daryl C. Joyce
dc.contributor.author Richard I. Webb
dc.date.accessioned 2021-07-27T05:27:48Z
dc.date.available 2021-07-27T05:27:48Z
dc.date.issued 2012-04-07
dc.identifier.uri http://repository.wyb.ac.lk/handle/1/3486
dc.description.abstract The mechanisms of action of Cu2+ in improving the longevity of cut flowers and foliage have not been elu cidated. Possible antimicrobial action of Cu2+ against stem end and vase solution colonising bacteria was investigated using Cu2+ treatments optimised for cut Acacia holosericea A. Cunn. ex G. Don foliage stems. These treatments were a 5 h pulse with 2.2 mM Cu2+ or a 0.5 mM Cu2+ vase solution versus a deionised water (no Cu2+) control. Bacterial growth over time was assessed by a standard plate count agar technique and with scanning electron microscopy. Cu2+ treatments significantly extended the cut foliage vase life. However, they did not have sustained antibacterial activity against stem end or vase solution colonising bacteria. Also, regular recutting of 1–2 cm from the stem ends did not substantially improve either cut stem water relations or longevity. The positive effects of Cu2+ treatments were unaffected by the repeated stem end recutting. It was concluded that the primary mechanism of Cu2+ was not antibacterial. More over, naturally growing vase solution and stem end microbial populations had relatively insignificant effects on cut A. holosericea vase life. Research into alternative mechanisms of Cu2+ is required. en_US
dc.language.iso en en_US
dc.publisher Postharvest Biology and Technology en_US
dc.subject Acacia holosericea en_US
dc.subject Bacteria en_US
dc.subject Copper en_US
dc.subject SEM en_US
dc.subject Vase life en_US
dc.subject Water relations en_US
dc.title Investigation of potential antibacterial action for postharvest copper treatments of cut Acacia holosericea en_US
dc.type Article en_US


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